DEK has developed a high-throughput backside wafer-coating process as a cost-effective packaging solution, provided by paste printer and capable to go well below the critical ±12.5µm total thickness variation required by most procedures. Reportedly the process is compatible with underfill or adhesive-type coatings which are normally applied at a nominal 50µm thickness to the backside of wafers prior to singulation. Using a standard printer platform helps to ensure high throughput and reducing the cost-per-package. The equipment used in the coating process includes an optional wafer handler, printer and reflow oven, and it is said to be also inherently more flexible than dedicated coating machines. The approach is compatible with the company’s metal stencil and emulsion-screen technologies. Metal stencils enable materials with larger filler particles, such as encapsulation paste, to be applied with a smooth surface finish. Mesh stencils allow other substances such as thermoplastic adhesives to be deposited accurately and at high speed. In each case, the capabilities of the machine and of stencil technology are key to achieving control over thickness and ensuring film uniformity at high volumes.
EPP EUROPE 429
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