The epoxy die bonder DA-3020 of Dias (in Europe represented by Quasys) has been recently revised, now featuring many options from the more expensive 8020 model – with no increase in costs. The large bond area of 150mm x 300mm, the possibility to pick from wafer or waffle packs, the high bond accuracy as well as the easily and quickly provided programming of all essential bond parameters are other important characteristics. This flexible equipment with its large range of options and the ability to be configured for many different applications in the bonding of active and passive components is an attractive alternative, and helps in fighting the pressure of constantly rising manufacturing costs.
EPP EUROPE 438
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