Speedline Technologies has enhanced its lead-free Electrovert Econopak Gold wave-soldering oven, designed to provide medium-volume manufacturers with high benefit, efficiency and versatility. The system is a compact and economical wave-soldering solution offering a host of performance refinements and features. The release of the UltraFill nozzles and a quick-change solder pot enhance its lead-free capabilities. The nozzles are 40% wider than the traditional tin-lead types. Their special design and location mean less superheat is required to reflow solder joints in the second wave. Significant benefits include improved hole fill, bridge defect reduction and reduced dross formation. The nozzles are available in Melonite corrosion resistant stainless steel or titanium. An optional nitrogen shroud encompasses the nozzles in the pot. It allows for air or nitrogen operation, and its lift design ensures ease of maintenance and dedrossing without the need for change or removal. The solder pot allows for a fast between two alloys such as tin-lead or lead-free solders. This results in significant savings compared to manual changeover. The unit includes a second pot with motors, pumps, flow ducts, nozzle and two trolleys. The lead-free-ready oven can be fitted with many features usually available only on high-volume systems, including nitrogen inerting, convection pre-heating, rotary chip wave, gas knife de-bridging technology and alternate fluxing options. The solder module provides ideal wave dynamics for densely populated boards, SMDs and difficult-to-solder geometries, processing boards up to 400mm and comes standard with 1.2m of preheat.
EPP EUROPE 423
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