Dage Precision Industries has launched the version 5 of its software for the series 4000/5000 bond testers as an answer to latest challenges, to offer higher performance. With ultra-fine pitch technology pushing bond pitch to 25 microns and below, the limits of wire-bond test are being challenged. Enhancements include Borescope imaging which improves loadtool-to-bond alignment and makes it easy for the operator to assign a grade to failures (only for series 5000). Other features provide movement of the tester loadtool to the next bond, where Auto-Back Clear moves the tool a safe distance from the bonds before Auto-Pitch moves the tool to the next bond (series 5000 only). The Auto-Fly Height function automatically moves the loadtool at a safe height across the surface of the die, removing all possibility of die damage. Auto-Grade Delay allows for an automatic movement of the tool up and away from the sheared bond, allowing backlight illumination for clear Borescope imaging.
EPP EUROPE 435
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