ViTechnology’s Profiler is designed for optimizing post-reflow inspection. Multiple cameras systems are still perceived as giving better results in those applications. The capability difference between multi-camera and single-camera solutions has now been totally eliminated due to this enhancement, reportedly at uncompromised inspection speeds. With special algorithms the gray-level profile of leads and joints is analysed in order to eliminate the need for angled-camera systems which are difficult to program and give high levels of false failures. Highly robust algorithms in combination with a custom built proprietary color-lighting source enable the detection of lifted leads, total or partial lack of solder, impurities and coplanarity defects, amazingly surpassing the test coverage of a number of multiple-cameras systems. This results in a more robust system, faster programming and minimizing false failures. The technology is integrated into the company’s AOI software suite, and the standard model library comes equipped with preset test parameters. A user-friendly auto-setting wizard quickens the programming time and the fine-tuning of inspection programs.
EPP EUROPE 468
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