Speedline Technologies introduced the MPM enhanced 2D option with a BridgeVision verification system that detects bridging defects on circuit boards. This technology utilizes texture-based image acquisition and a digital-camera system with software algorithms to identify those defects during post-print inspection. Research shows that bridging defects represent the number-one quality concern for SMT manufacturers, to now be efficiently addressed from the company with this solution for its printers. The software allows reviewing and tracking of bridging potential and preventing borderline products from slipping through the assembly process. BridgeVision also assesses paste transfer efficiency based on dimensional analysis of deposit against aperture size. This useful tool provides fast, accurate review and charting of the deposit area for each device. In addition, with the digital camera, the system is even more robust in low-contrast applications, such as ceramic substrate processing. The system is available as an option for the AP Excel printers and as an upgrade for installation in the field in both AP Excel and AP HiE machines running NT operating systems. (NT upgrades are available for HiE systems running DOS).
EPP EUROPE 420
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