DuPont Electronics & Imaging Interconnect Solutions (ICS), the integrated materials solution partner for advanced interconnects, introduced metallization offerings in advanced development stages for High-Density Interconnect (HDI) applications, a high-performance and fast-growing segment of the Printed Circuit Board (PCB) industry. The offerings are part of the DuPont Electronics & Imaging ICS broad platform of products, where performance is optimized through product synergies and close partnership with customers.
The offerings include newly developed ionic palladium catalyst products for horizontal electroless copper systems, and a via-fill electrolytic copper solution. These next-generation technologies are designed for fine-line HDI applications and deliver both high reliability and improved productivity. These qualities make them particularly suited to various application needs for smartphones, consumer electronics, telecom, and automotive.
“DuPont Electronics & Imaging ICS is committed to delivering a broad platform of integrated and advanced circuit materials to serve the PCB industry, and metallization products are part of it,” said Avi Avula, Vice President, General Manager. “We continue to invest in technology to bring new and advanced solutions to our customers, OEMs, and industry partners to drive innovation and enable next-generation product platforms that address the most challenging issues in the industry.”
DuPont Electronics & Imaging ICS metallization products have a long-standing reputation for excellent performance, consistent quality, and support from a strong, global R&D and technical service team with deep fundamental knowledge and know-how. Building upon these strengths, products are being launched in two areas:
- Circuposit 6000 series – to address growing demand for ionic catalysts for horizontal electroless copper system. These products deliver high reliability and productivity regardless of application needs.
- Microfill EVF-III – electroplating solution for via-filling and through-hole plating in the fine-line HDI market, providing better surface uniformity, reduced scratch mark sensitivity, and wider operation latitude for a 20 % productivity improvement at up to 20 ASF (Amperes per Square Foot).
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