Henkel Technologies’ Hysol QMI 550SI is a low-CTE, silica-filled, dielectric die-attach adhesive designed to bond non-active package surfaces, such as bottom-die-to-substrates and die-to-dummy-spacer-die, in same size stacked die packages. Hydrophobic and stable at high temperatures, the material produces void-free bond lines with high adhesion strength to a variety of organic and metal surfaces, including polyimide, BT, FR and gold. Packages manufactured with this adhesive have high resistance to delamination and popcorning after multiple exposures to reflow temperatures. It allows prebake and can be cured in just 10 s after reaching 150 °C. The product is a cost-effective solution that can be realized through skipping prebake and using organic spacers, and it is JEDEC Level 3 capable for 260 °C reflow in tape-array BGAs.
EPP EUROPE 444
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