Phoenix launched a plug-in software modules for automated X-ray inspection of concealed solder-joint features. Similar to the proven bga|module, the new qfp|module covers the inspection criteria of the acceptance standard IPC-A-610C. The software detects and evaluates all features of QFP-type solder joints (flat ribbon, L, gull-wing leads) including quality of heel fillet, side and toe fillet, bridges and electrical clearance, opens, side overhang, joint width and toe overhang, lead footprint, co-planarity and voiding percentage. For the increasing use of micro lead-frame devices (MLF), the new mlf|module can be adapted to the various land-lead configurations of this type of SMD. For other types of solder connections, appropriate plug-in modules can quickly be customized with the XE2 software package for the development of image evaluation procedures. Defects are recorded and their images are stored. The results may be visualized by the novel quality|review software which is the link to rework, displaying the defect in the original X-ray image together with its classification from the inspection record and indicating the position of defects in an X-ray map of the sample. The software offers easy data management and sample identification by reading the serial numbers.
EPP EUROPE 445
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