The Alphasem Easyline 8033 clip-attach system provides the answer for high-speed, cost-driven applications on power devices. This process replaces the standard wire connection between the die and the leads with a solid copper bridge. The main advantages of this are low RDSON and package resistance, ultra-fast switching performance due to small package inductance, low dynamic losses due to low gate charge, increased efficiency, lower board space and package height. It is the ideal for many chip designs and for a wide product range, eliminating wire bonding. Curing of the complete package is performed in the integrated reflow oven. Reportedly, the tool delivers high placement accuracy, excellent dispense control, gentle die, clip, and leadframe handling combined with high productivity for 200mm applications with a speed of up to 14000uph (2-machine configuration). Compared to typical die and wire bonding configurations, the 8033 delivers gains in cost-of-ownership. So, for reduced footprint (–30%), minimized number of operators (–25%), reduced equipment costs (–25%), more than 500% increased throughput. The maximum leadframe size has been enlarged to 90 x 270mm (3.54 x 10.63-in). The modularity offers a wide variety of options, thus further broadening its application range, ensuring later upgradeability and avoiding unnecessary equipment investments. Currently available are real-time wafer-map display, dispense inspection, on-screen matrix bond position display and many more.
EPP EUROPE 445
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