The Alphasem Easyline 8033 clip-attach system is the answer for high-speed clip-attach applications for power devices such as SOD, SMA, DPAK, TO 220, etc. The clip-attach process replaces the wire connection between die and the leads with a solid copper bridge where no wire bonder is longer needed. The main advantages of this are low RDSON and package resistance, ultra-fast switching performance due to small package inductance, low dynamic loss because of low gate charge, etc. Curing of the package is performed in the integrated reflow oven, eliminating the need for an external furnace. Based upon the Easyline platform, the equipment provides high placement accuracy, dispense control and gentle handling of die, clip and lead frame. Compared to usual die and wire bonding systems, this solution delivers benefits in the cost-of-ownership issue: less footprint (about 30%), reduced number of operators, reduced equipment costs (25%) and more than 500% increased throughput. The maximum lead-frame size is 90 x 270mm. The modular approach ensures upgradeability in the field and avoids unnecessary investments. Currently available are options such as real-time wafer map display without additional monitor, dispense inspection, on-screen matrix bond position display and much more.
EPP EUROPE 445
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