The Zestron Vigon A 300 was developed to meet the increased usage of hard-to-remove flux residues of highly polymerized solder pastes. This water-based MPC cleaning agent operates already effectively at room temperature. Due to its very high cleaning performance, it removes successfully all standard fluxes residues as well as the hard to remove fluxes. The liquid is non-foaming and can be used in high and medium pressure spray equipment such as in-line and batch and centrifugal equipment. Using the specially designed booster Vigon plus BA 30, the process window can be even further increased.
EPP EUROPE 456
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