The Heraeus F 620 lead-free, no-clean solder paste shows no tendency to hot slump, and reportedly features excellent print-after-wait properties. A major benefit is the high tack of the paste. Its rheology is optimized to allow high performance with narrow stencil openings. The paste also provides superior wetting capability, a variety of commonly used industry profiles, and can be soldered in both air and nitrogen, on surfaces with NiAu, immersion Sn, Cu OSP and alternative surfaces. The formulation has a very high SIR, with no migration or dendritic growth after storage in harsh conditions, as well as no beading and mid-chip balls. The solder flux passed the generally applied surface insulation resistance tests, even under the harsh conditions demanded by the automotive industry: 85°C/85%rh, 21 days, and measurement with 100VDC. During in-circuit tests, the probe needles can easily penetrate the flux residues, and only very clear residues remain, even after several contacts.
EPP EUROPE 426
Share:
