Palomar’s model 5060 automatic ball bonder and 5070 wedge bonder offer large-area, deep-access wire bonding for packaging applications. They are based on the proven and reliable 2460 and 2470 platforms, but with a 25 % smaller footprint of 36 x 30-in (915 x 760 mm). They have a large 12 x 5-in (300 x 125 mm) work area, and are designed for ergonomic operation. The on-screen, menu-driven interface simplifies operator training, allowing for a short path to automated production. The sleek design includes ergonomically placed control knobs, and a keyboard that can be adjusted to optimize the operator’s working position. The 5060 ball bonder provides thermosonic ball and stitch bonding with a heated work stage and an optional capillary heater. The 5070 wedge bonder provides ultrasonic or thermosonic bonding with a heated work stage, capable of handling round wire, gold or aluminum ribbon. Customers currently using Hughes or Palomar 2460-V or 2470-V bonders can run programs on the new equipment. Changing from manual wire-bonding to automation results in higher yields (due to high repeatability) and predictable, repeatable electrical performance. The 5060 and 5070 are designed to provide an easy transition of this kind.
EPP EUROPE 461
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