Viscom’s optical inspection systems can also provide the measurement of plugs and connection pins on board assemblies. The integration of a Z-axis mechanism allows precise measurements over a height difference of 50mm using high-resolution inclined and orthogonal mega-pixel vision systems. A motor-driven Z-adjustment for the image-sensor head has been integrated as an option to the standard AOI systems. The height level is set using the library, so that optimum adaptation is provided. The concept is based on a multi image-sensor concept, whereby the orthogonal or inclined camera views or combinations of these can be applied, depending on the defect criterion. High throughput and inspection depths are combined optimally this way. Missing as well as bent pins are reliably recognized. In addition, pins can be measured and the value compare with specified limits. The advantage of this technique to other solutions: the inspection capability for solder joints and components is completely maintained without losses.
EPP EUROPE 450
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