The Viscom AXI system X8051 for in-line operation inspects for defects under hidden solder joints, for example, under BGAs, mBGAs, MLFs or else under THT-soldered connector strips, by means of the oblique camera angle and without having to resort to an elaborate 3D procedure. With this method, which also uses depth information, even the particularly critical voides in the heel of gullwing solder joints can reportedly be detected and analysed. It is also possible to determine the amount of filling and the proportion of voids in THT solder joints. Impairment of the strength of these connections is thus detected in advance. Based on a flexible and well-tuned system concept, the cycle time of the AXI (automated X-ray) inspection is considerably reduced. Because of the larger inspection area, it is possible to load several objects simultaneously. And in addition to this, the X8051 system can be also fitted with the company’s AOI modules. Configured this way, the AOI modules can be used to perform inspection routines for which X-ray technology is not required, possibly leading to an even higher throughput rate.
Productronica, Booth A2.475
EPP EUROPE 466
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