Wave soldering and reflow processes are a high challenge for an adhesive that is used to fix components on board assemblies. The reliability of many SMT adhesives decreased particularly with special forms, i.e. barrel-shaped MELFs and critical materials such as glass. Delo’s adhesive Monopox MK096 ensures a reliable hold of particularly critical components during soldering (with temperatures up to 250°C). The pasty adhesive is a heat-curing, 1-part epoxy resin, optimized for high-speed as well as for manual processing. Achieving a high adhesion extremely fast within 60 sec, this adhesive provides shear strength of 25N. Already after 3 minutes, when comparable products have reached about 10N, this adhesive has a final shear strength of 70N. This not only means that the cycle times are shorter, but also that the reject rates are significantly lower, and less manual rework is required. The material can easily be processed on all standard dispensing systems. The adhesive can either be jetted, dispensed from a cartridge or applied by using screen-printing. The drops on the substrate are reproducible and firm – even during jetting, because the viscosity of the adhesive has been specially adjusted. Over 30,000 drops per hour can be reached. The red-colored adhesive makes a visual control of the application easier. The material shows a universal adherence on different types of substrates. Processing time at ambient is specified with approximately 4 weeks, shelf life at +5 to +8°C is claimed with 6 months. The ion contents (Na+, K+) are under or equal 10ppm. These properties make it an all around success in board assembly operations.
EPP EUROPE 431
The small cartridge adhesive Delo Monopox MK096 can be inserted in all standard holding devices of dispensing equipment
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