In addition to 2D AOI evaluation for offset, completeness and smearing, Viscom now presents 3D paste inspection as an option for the S3054QS QuickScan system. The 3D option can particularly be used for critical components such as BGA, flip-chip devices, etc. The AOI system offers short programming time as well as robust and high-speed defect recognition, particularly suitable for flexible application. High first-pass yield is achieved even during the first run, i.e. an extremely low false alarm rate with inspection time less than the line-cycle time. 3D inspection is also available for checking paste print. For this application, Viscom implemented a lighting method using a dual-line laser illumination, allowing optimum image recording. With the aid of this 3D sensor, a height resolution of 10µm is possible. This is particularly useful for boards with critical print structures such as BGAs, finch-pitch ICs, etc. In addition to the error characteristics of missing paste, smearing and short circuits, this allows the height of the past print, the paste volume and the topography to be measured and evaluated.
EPP EUROPE 458
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