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New center for semiconductor research opened in Dresden

Fraunhofer
New center for semiconductor research opened in Dresden

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Fraunhofer Logo

A flagship of semiconductor research with international reach is emerging in
Dresden. Fraunhofer IPMS and Fraunhofer IZM-ASSID are bundling their
competences and establishing the Center for Advanced CMOS &
Heterointegration Saxony. The center will offer the complete value chain in
300 mm microelectronics, a prerequisite for high-tech research for future
technologies.

With Fraunhofer IZM-ASSID and Fraunhofer IPMS’ Center Nanoelectronic Technologies
CNT, two unique research facilities in Germany in the field of microelectronics are
located in Saxony. Today, they are the only two German research centers for applied
microelectronics research based on 300 mm wafer industry standard equipment. With
the bundling of competences and the foundation of the Center for Advanced CMOS &
Heterointegration Saxony, excellent perspectives arise to attract semiconductor
companies and system users as well as material and equipment manufacturers
worldwide. In addition to excellent personnel and know-how, equipment with a
modern equipment and plant park is crucial for industrial and research contracts.

With an investment volume of about €140 million in clean room facilities, Fraunhofer
IPMS is uniquely positioned in Germany in the field of applied research on the modern
300 mm wafer industry standard in the front end of CMOS manufacturing. Fraunhofer
IZM-ASSID complements this expertise with innovative packaging and system
integration technologies. In the future, the center will be headed by Dr. Wenke
Weinreich, division manager at CNT and deputy institute director of Fraunhofer IPMS,
and Dr. Manuela Junghähnel, site manager at IZM-ASSID.

Investment in future technologies

 

„The joint center with a clean room of 4000 m² in size enables close cooperation and
networking of the scientific and technical competencies of both research institutions.
This creates an outstanding R&D technology platform as well as an increase in
efficiency and completion of the value chain, which at the same time opens up new
research fields,“ explains Dr. Manuela Junghähnel. Dr. Wenke Weinreich adds: „The
300 mm wafer industry standard is crucial, because it is the only way to ensure a fast
transfer of research results to the semiconductor industry in Saxony, nationwide and
also worldwide. On the other hand, this wafer standard is also a basic requirement for high-tech research for future technologies, such as neuromorphic and quantum computing.“

Ceremonial opening

 

The Center for Advanced CMOS & Heterointegration Saxony is being built at one of
Fraunhofer IPMS’ sites in Dresden in the new 4000 m² clean room and is being
ceremonially opened today. Saxony’s Prime Minister Michael Kretschmer: „Saxony is
one of the leading microelectronics locations in Europe. Every third European chip is
produced in the Free State of Saxony. With the European Chips Act, the EU has set the
course for further investments. Saxony relies on close networking between industry,
science and research. The new Fraunhofer Center for semiconductor research is unique
in Germany and will make a decisive contribution to innovation in Silicon Saxony. In the
future, applied microelectronics research with state-of-the-art 300mm wafers will take
place in Dresden at world level. High-tech research for future technologies ensures
innovative strength and prosperity in the Free State of Saxony. I thank the FraunhoferGesellschaft for its clear commitment to Saxony as a location.“

The President of the Fraunhofer-Gesellschaft, Prof. Dr. Reimund Neugebauer, is also
impressed: „The new Center for Advanced CMOS & Heterointegration Saxony is an
excellent example of proactive shaping of the European development of semiconductor
technologies and makes an important contribution to securing our technological
sovereignty. By bringing together excellent scientific and technical competencies, the
center will efficiently map the entire value chain of semiconductor technologies in the
future – from research and pilot production on 300 millimeter silicon wafers to contacting and final assembly.“

For the future development of the necessary competencies in microelectronics and
microsystems technology, the R&D offerings of Fraunhofer IZM-ASSID and Fraunhofer
IPMS with regard to 300 mm process competencies will be designed and expanded in
such a way that local and national industry from SMEs to large companies (e.g.
Globalfoundries, Infineon, Bosch) will be able to benefit from the latest technologies in
the best possible way. The integration platform is also used in customer-specific
projects as part of the High-Performance Center „Functional Integration in Micro- and
Nanoelectronics“ performance center and in the Research Fab Microelectronics Germany (FMD).

With a positive view of this network, Saxony’s Minister of Science Sebastian Gemkow
concludes: „For the future of microelectronics research and technology development in
Dresden, Saxony, Germany and Europe, the opening of the CNT is a milestone. In a
joint effort of the Fraunhofer-Gesellschaft, the federal government and the Free State
of Saxony, we have succeeded in securing one of the leading research facilities in the
field of 300mm technology for the long term. IPMS-CNT and IZM-ASSID focus on
strategic and deepened cooperation within the Center for Advanced CMOS & Heterointegration. Thus, ‚Silicon Saxony‘ will be further strengthened and will make important contributions to the processing of future topics in microelectronics in the future.“


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