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Koh Young: Provider of 3D Measurement-based Inspection Equipment

Semiconductor Packaging
Koh Young: Provider of 3D Measurement-based Inspection Equipment

Koh Young Logo
Source: Koh Young

Koh Young Technology Inc., a leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization in the production fields of diversified industries including automotive, telecommunications, military, and semiconductors.

Established in 2002, Koh Young pioneered the market by launching the first 3D Solder Paste Inspection (SPI) system using a patented dual-projection Moiré technology. Since then, it has become the global leader in 3D measurement-based SPI and Automated Optical Inspection (AOI) equipment for the electronics industry.

Semiconductors have driven advances in communications, computing, health care, military systems, transportation, clean energy, and countless other applications. And they are giving rise to new technologies that hold the promise to transform society for the better, including brain-inspired computing, virtual reality, the Internet of Things, energy-efficient sensing, automated devices, robotics, and artificial intelligence. Semiconductors’ greatest potential lies ahead.

The existence of an efficient, innovative, resilient, and sustainable semiconductor industry is in the strategic interest of Germany and Europe. The semiconductor industry plays the important role of supplying the downstream industries. Its progressive and targeted expansion contributes indispensably to a high degree of technological sovereignty and to the achievement of social, economic, and ecological goals. Research and development in industry is crucial to create IP, products, and system solutions, and needs an expansion of appropriate policy instruments. In  addition, there is a lack of adequate framework conditions to support the improvement of existing production and the expansion of future capacities in Germany and Europe beyond the Important Projects of Common European Interests.

Koh Young Meister
The Meister by Koh Young. Source: Koh Young

As advanced packaging continues evolving, device thickness is paramount since consumers demand smaller products with more functionality. Therefore, the company has released the MEISTER product family, a portfolio of True 3DTM Inspection Solutions for solder paste, printed bumps, and solder ball as well as small components like 0201Ms and highly reflective die. With those solutions, it is possible to inspect SiP, FCBGA, FOWLP/FOPLP and WLCSP packages with high UPH (Unit per Hour).

The inspection capabilities of those Koh Young products have already been qualified for mass production by major semiconductor companies throughout the world.

The company’s activities stem from the corporate headquarters in Korea to its sales and support offices in Germany, Japan, Singapore, Vietnam, Malaysia, China, Brazil, Argentina, Canada, Mexico, and the United States. These local facilities ensure it keeps in close contact with the market, and more importantly, its growing customer base to provide access to an award-winning network of inspection and measurement experts.

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