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A leading semiconductor equipment supplier originating from Europe

Besi/Datacon’s executive Helmut Rutterschmidt on the companies’ merger, market position, portfolio and innovative technology
A leading semiconductor equipment supplier originating from Europe

With the merger of Besi and Datacon, a globally leading supplier of semiconductor-packaging equipment was born. How would you characterize the position and portfolio?

The six business units of BE Semiconductor Industries (Besi) offer the most complete modern packaging solution, from die-sorting to assembly right through to finishing. Laurier supplies automatic die sorters and high-precision flip-chip solutions for CSP and opto-devices as well as cutting-edge technologies for RFID assembly. Datacon is the specialist in automated equipment for flip-chip and die assembly for a broad spectrum of applications, beginning with process design and extending right through to reel-to-reel production. Fico provides integrated cutting, separating and handling systems for matrix-array packages, and automated systems for molding semiconductors in epoxy resin, as well as cutting and shaping the metallic connections of encapsulated semiconductor. Meco is focused on silver and tin-plating of stamped or etched leadframes. As a leading supplier, our customers include semiconductor manufacturers and assembly houses from the US, Europe and Asia.
What kind of synergies do you see and how will they provide value for your customers?
The individual business units are continuing to appear as independent companies in the market and are striving to optimally serve their customers. The only change the users will recognize is how our network, and therefore our ability to suit their needs, is enhancing and developing. Internally, we utilize synergies in the fields of R&D, sales and manufacturing. Besi has already set up a basic network in Asia, which means that, due to the merger, we are now able to sell, for example, Laurier products through Datacon. But not only in Asia, we are handling this the same way in Europe. We are also beginning an intensive exchange of process expertise, which leads to optimally synchronized product strategies, such as our improving RFID (radio frequency identification) program.
Datacon has been one of the shooting stars in advanced packaging originating in Europe. Do you think this success can be maintained?
We not only think, we know it will be maintained, and will even faster grow. Now, as member of a strong financial public company, we can bring Datacon up to a new level, for our customers and for ourselves.
Let’s have a look at the global regions. What are your market shares and what do you expect in the future?
In Europe, Datacon will maintain the leading position with a total market share of 70 to 80% and retain the customers with good service and support. We are expecting strong growth in Asia. With the versatility of our equipment and stronger local presence, we have a fair chance of increasing our market share. According to analysts, Datacon has a market share in the flip-chip bonder segment of 26%. And we are committed to enhancing this position within the near future. Datacon not only develops and manufactures machines, but also is actively involved in the research and development of advanced packaging and contributing its rich knowledge and skills to the market.
You are currently introducing a flagship flip-chip assembler for RFID products. What are the key performance data and what about competition in this area?
Our technology roadmap brings together different goals benefiting the customers. First, it’s about optimum cost structures which, on the one hand, reduce manufacturing costs, but also the costs of ownership. Then take performance features such as the assembly throughput which is constantly being improved. The third target is to extend the versatility of our machine platforms, which can thus be optimized to become future-proof for all kinds of different processes and applications. This feature is especially important for capturing new markets. Furthermore, we don’t just want to be known as „another supplier of packaging equipment”, we also deliver advanced process technology and accompanying knowledge.
Will RFID have a chance to become a mainstream application, both technologically and cost wise?
RFID is an important segment of the semiconductor industry of the future. This is confirmed by forecasts of 10bn RFID tags for logistics purposes in the years 2007/2008. The main trendsetters here are the large supermarket chains in the US, which are expecting significant cost savings and other benefits. Datacon has designed a very versatile flip-chip assembly platform for RFID manufacturing, covering a broad range of throughput versus precision numbers. Strategic investment in this segment will also continue within the framework of the new organization. However, since no single form of application has emerged as dominant from the variety of possible models, so the flexibility of the Datacon platform is proving very beneficial here.
What is your forecast for the flip-chip market for the next ten years?
For years now an upsurge in the flip-chip market has been forecasted, which we are not really expecting to happen in the next two years. This is due to the negative effects of both the high substrate cost in the currently applied production process and the expenditure for the manufacturing steps such as bumping and underfill. But there are indications of moderate growth coming from the smartcard sector, where the cost-efficient non-conductive paste (NCP) process is being used increasingly. The new process enables a lower-cost substrate to be used, requires no underfill process, and incurs less expense thanks to electroless nickel-gold bumping. Because the NCP process is still relatively new, it is now a matter of increasing the customer acceptance of this cost-effective process as quickly as possible
Is flip-chip packaging a market for high expectations, or are there other fields of application in the backend area which are just as important or even more so?
Packaging basically serves to make the functionality of integrated circuits manageable. It is defined by two characteristic key values: performance and costs of the assembly and bonding technology of the device. Only manufacturers who have all the resources in their hands, for example low-cost technology (flip chip), the most cost efficient material and adhesives, can bring fresh and cost-effective packages onto the market which satisfy all the required static, dynamic and thermal parameters. In the packaging sector, all the factors involved can be reduced to one common denominator, simply cost, and this is the basis for all developments in packaging.
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Titelbild EPP EUROPE Electronics Production and Test 11
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11.2023
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