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Welcome to the SMT Hybrid Packaging 2016

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Welcome to the SMT Hybrid Packaging 2016

Welcome to the SMT Hybrid Packaging 2016
Anthula ParashoudiVice President, Mesago Messe Frankfurt GmbH Foto: Mesago Messe Frankfurt
Visitors to the SMT Hybrid Packaging trade fair, the International Exhibition and Conference for System Integration in Micro Electronics, can look forward to a diverse program and highlights this year. They experience the whole variety of assembly production from 26 – 28 April 2016 in Nuremberg, Germany.

Under the slogan “Living the digital age: Work and home in a networked world. What challenges do living and working in a digital world present for electronics assembly?” the Fraunhofer IZM is once again organizing the production line “Future Packaging”. Its business and science partners present technological innovations and their practical realization. Additional, visitors will be able to get technological consulting directly at the machine from experts.
This year, the conference of SMT Hybrid Packaging 2016 focuses on Industry 4.0. The delegates receive professional expert knowledge at first hand; on the second event day the conference informs about ”Assembly Technologies for Intelligent Sensor Systems- Requirement for the Internet of Things”. On the following day, the delegates learn more about future developments in the industry regarding “Assembly Production 2020 – Implementation with Industry 4.0”.Additional to topics for basic knowledge, there are five practice-oriented tutorials and two workshops held in English. All sessions will thus provide an ideal platform for exchanging information about technological advances and discussing issues with experts on-site.
We are delighted that the new hall layout introduced last year was so well received and we intend to continue with this successful concept again this year. So visitors to SMT Hybrid Packaging 2016 can look forward to taking the optimum tour round the event – following the value chain. Like last year all the exhibition and conference events are located together at the NCC East entrance.
Offering an overview of the whole sector of system integration in microelectronics the SMT Hybrid Packaging is certainly “the place to be”. Visitors benefit from a wide presence of the industry. Each exhibitor takes pride in answering every single question and in helping to solve each visitor’s challenges.
I would be very pleased to welcome you at the SMT Hybrid Packaging, 26 – 28 April 2016 in Nuremberg, Germany.
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