We are more than pleased to say that after the economic crisis in 2009 and 2010 the SMT sector is prospering again. Companies are investing and exhibitors who did reduce their exhibition space in the past years are expanding their booths again. And even more important, many first time exhibitors are showcasing their products and services. One of the highlights will definitely be the production line organized by the Fraunhofer Institute for Reliability and Microintegration. With the focus on “Highest precision at smallest lot sizes” the exhibitors involved will present the latest technological advances and their implementation in the manufacturing process. A key attraction for the visitors will be the production line demonstrations being offered several times a day in both English and German.
For the first time this year there will be a group stand of the German Research Association 3D-MID e.V. (booth 6-226), where over a dozen companies and institutes will offer insight into latest MID technologies and innovations. Another new feature is the Electronics Day on 4 May, 2011 provided by the Sustainability in Electronics Manufacturing (SEM) Working Group. Needless to say the focus will be on sustainability and its aim to encourage the electronics industry to adopt more environmentally friendly practices.
The joint booths „Opto Electronics“ (booth 6-115) and Service Point EMS (booth 9-304) will offer well presented and comprehensive information and provide visitors with the chance to compare several solutions on-site. Panel discussions, such as „EMS in focus“, organized by the ZVEI, will additionally provide in-depth knowledge and support. In addition to the wide range of information at the exhibition 19 practically based tutorials (including four in English) will provide answers to key issues of electronics manufacturing, such as LED’s, energy efficiency, traceability, reliability etc. „Reliability of multifunctional electronic devices – modern methods of analysis and test strategies” is the title of this year’s conference programme on Wednesday (held in German), focussing on the analysis and manufacturing process qualification for the development and production of complex, multifunctional electronic assemblies. All three conference days will provide an ideal platform for exchanging information about technological advances and discussing issues with experts on-site.
Once again the SMT/Hybrid/Packaging will offer a unique overview of the whole sector of system integration in microelectronics. Visitors will benefit from a combination of a broad industry representation and the manageable size of the fair.
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