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Solderstar to introduce new thermal profile solutions

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Solderstar to introduce new thermal profile solutions

Solderstar_Productronica_VP_NANO.jpg
The company‘s VP Nano system allows engineers to capture thermal profiles of complex electronic assemblies that utilise numerous components or require higher mass PCB substrates. Source: Solderstar

Manufacturer of thermal profiling systems for electronic soldering processes, Solderstar has announced that it will attend its first trade exhibition since the Covid-19 pandemic began. The company will present its latest range of thermal profiling solutions to visitors of Productronica which will run from 16–19 November, 2021 in Munich, Germany. The company says the show will be used as a platform to highlight several new additions including the VP Nano system, along with the new SLX – a zero setup profiling system for reflow and wave solder applications, as well as the VP Nano system which allows engineers to capture thermal profiles of complex electronic assemblies that utilise numerous components or require higher mass PCB substrates.

“As the first live exhibition in some time due to the pandemic, the team at Solderstar are very much looking forward to meeting with members of the electronics industry face to face again,” said Mark Stansfield, Managing Director at the comapny.

“Since the last Productronica show we have been working on improving and developing new solutions that are making a huge difference to our customer’s productivity. Visitors to the exhibition will be introduced to the VP Nano system which includes a state-of-the-art re-chargeable micro miniature datalogger and improved thermal shield for better security and protection within the oven. We will also be using the show to launch the new Solderstar SLX Datalogger, a unique system which includes advanced smart adapters to allow profiling of soldering machines with zero setup and configuration.

“As well as new equipment development, we have recently updated many of our software packages for reflow and wave soldering. They now feature integrated tools for automatic profile setup and checking, and a Statistical Process Control tool to leverage profile data for trend analysis and prediction of process problems before they happen. These new improvements provide an immediate insight into the performance of the process, providing engineers with an invaluable understanding of the manufacturing environment.

“So much has changed since we last exhibited at Productronica. We are looking forward to using the show as a platform to introduce our new portfolio additions and demonstrating how they can support electronics manufacturers,” concluded Stansfield.

To see the company‘s latest range of thermal profiling tools and software, or to discuss specific process problems, visit booth A4.240 at Productronica, 16–19 November, 2021 in Munich, Germany.

Hall A4, Stand 240

www.solderstar.com

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