The conference and exhibition Micro System Technologies 2005 will take place in Munich/Germany on October 5 and 6. The event will present the latest in the development, production and application of microsystems technologies. Since 1990, the bi-annual event has drawn top experts from leading international companies and research institutions. 46% of the over 500 attendees at the last event in 2003 came from outside Germany. As conference chair Prof. Dr. Herbert Reichl, Technical University and Fraunhofer IZM, Berlin outlines, “Micro scale devices are an indispensable part of many products. Sensors and actuators are becoming integral to automotive, medical, telecom, photonic and other products. Combining micro-devices and microelectronics in hetero-system packages, new product visions can be realized and made available to all”.
The following keynote speeches will be given: BioMEMS packaging, Marc Madou, University of California/USA; accelerometer technology developments, Andreas Wild, Freescale Germany; Fred von Roosmalen, Philips Semiconductors/NL, on integration techniques; Krishnendu Chakrabarty, Duke University/USA on synthesis and reconfiguration techniques for digital microfluidics-based biochips. Other subjects are advanced MEMS processes and technologies; MEMS and MST packaging; functional integration and devices, materials and their characterization; nano structures and devices; assembly and interconnect; reliability, test and quality of microsystems; design and simulation, etc. “Packaging has been regarded often as a necessary, but non-value added- process”, Herbert Reichl points out. “With microsystems, packaging will bring in a paradigm shift. With sensors, generic MEMS devices and actuators combined with powerful electronics, a functional package will bring down the cost of the final system, increase its performance and provide an easy-to-use handling format. The full synergy of such a combination can only be achieved if the packaging process becomes an integral part of the product design. The future level of hetero-system integration will include new concepts, materials, processes, design suites, simulation tools and new technologies. Those are now under development”.
EPP EUROPE 412
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