Eastern Europe’s growing electronics assembly industry faces new challenges, especially with the adoption of lead-free technology. To connect manufacturers with solutions to these challenges, IPC – Association Connecting Electronics Industries is holding the IPC Conference on Quality, Reliability and Acceptability for Electronics Manufacturing in Budapest, Hungary on 22 to 24 February 2011. Cosponsored by the Hungarian Electronics Association, the event offers workshops, a conference and tabletop exhibits. Conference topics include the Importance of IPC Standards in Quality and Reliability, State of the Hungarian Electronics Industry, Environmental Regulations Impacting the Electronics Industry: PCBs and Electronics Assembly, the effect of Moisture Levels in Laminates during Lead-Free Processing, IPC-7351B Land Patterns: Reliable footprint and land pattern configuration in a lead-free environment, Common Solder Joint Problems During Live Production at S.E.E. 2010, Fighting Tin Whiskers – Causes and Solutions, Minimizing Defects in the Assembly Process Including „Head on Pillow“, Portable Test Methods for Lead-Free Solder Alloys and Acceptability Requirements for Rework and Repair. Half-day educational courses will be taught by experts Bob Willis, Lars Wallin and Lars-Gunnar Klang. Their courses include the use of IPC standards in the manufacturing process, conformal coating applications, properties of lead-free alloys and land grid array/quad flat no-lead design and assembly. Suppliers can gain new visibility in Eastern European by signing up as gold or silver sponsors. Gold sponsors will receive tabletop exhibit space, two free registrations and promotional opportunities. In addition, they will be invited to make noncommercial technical presentations. Silver sponsorships include tabletop exhibit space, one complimentary registration and promotional opportunities.
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