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IPC Apex Expo 2014 – Exhibit space was sold out

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IPC Apex Expo 2014 – Exhibit space was sold out

IPC Apex Expo 2014 – Exhibit space was sold out
IPC — Association Connecting Electronics Industries announced that all 135,000 sq. ft. of exhibit floor space was sold out for IPC Apex Expo 2014, making it the largest show in the last five years.

To visitors, the sold-out status meant that the show floor was busy and informative, with more than 425 exhibitors introducing new product technologies, innovations and demonstrations of the industry’s newest advancements, many of which were also be highlighted in the dedicated New Product Corridor on the show floor. Top-rated suppliers presented best-in-class equipment, materials, processes and services to help attendees gain greater efficiency while improving their bottom lines. “One of the top objectives for attendees was to see new products on the show floor. IPC Apex Expo has been recognized as the ‘best show to do business,’ and provides ample opportunities to network with existing customers, meet new customers, grow business and increase revenue,” said Alicia Balonek, senior director of trade shows and events.
Changing technologies that are driving the electronics industry were center stage throughout the technical conference. In keeping with the event’s theme, “New Ideas … For New Horizons,” industry experts presented 100 technical papers detailing original research and innovations in the areas of board fabrication and design, electronics assembly and test.
“Industry professionals need to keep up with changing technologies to stay on track for success,” said Jasbir Bath, IPC Apex Expo technical conference director. “The papers selected by the technical program committee delivered on bringing attendees solutions to today’s challenges as well as preparing them for emerging technologies that will shape the industry’s future.”
Conference attendees did have the opportunity to learn about advancements in the areas of for example nanomaterials; solder paste and epoxy reliability; assembly and reliability of bumped components; printed electronics; miniaturization and high density; printing; embedded technology; corrosion and tin whiskers or BTC reliability.
Next year the show will shedule the 24. – 26. of february in San Diego, California.
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