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Indium Corporation to showcase lead-free mixed-alloy technology

Events - EPP InnovationsFORUM
Indium Corporation to showcase lead-free mixed-alloy technology

According to the company, the high temperature alloy features a novel design based on a mixed-alloy technology, designed to deliver a tin-rich HTLF paste, presenting the merits of both constituent alloys

Materials manufacturer and supplier to the global electronics, semiconductor markets Indium Corporation will showcase its Durafuse technology at the EPP InnovationsFORUM on Tuesday 28 June in Leinfelden-Echterdingen, near Stuttgart in Germany.

“The harmful effects of lead on human health and the environment are driving the development of high-temperature lead-free (HTLF) solders to replace high-Pb solders for die-attachment and clip-bond in power device applications,” the company explained

High temperature

“Indium Corporation’s Durafuse HT features a novel design based on a mixed-alloy technology, designed to deliver a tin-rich HTLF paste, presenting the merits of both constituent alloys. The alloy delivers:

  • Simplified processing; Durafuse HT is a drop-in replacement for high-Pb solder, with no special equipment needed and minimal process adjustments
  • Enhanced thermal cycling reliability; equal or higher than high-Pb solder
  • Lower RDS(on) compared to high-Pb solder+

Low temperature

The company’s Durafuse LT is a patented low-temperature alloy system designed to provide high-reliability in low-temperature applications that require a reflow temperature below 210°C. It delivers:

  • Improved drop shock performance more than two orders of magnitude better than Bi-containing low-temperature materials
  • Drop shock performance equal or better than SAC305 with proper process optimization
  • Ideal characteristics for step soldering and low-temperature requirements

www.indium.com

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