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Automotive electronics reliability forum

Preamble to SMT Hybrid Packaging
Automotive electronics reliability forum

Fueled by strong growth in electric vehicles and autonomous cars, and a dramatic increase in electronics content in conventional automobiles and trucks, thought leaders and subject matter experts from the leading electronics companies will meet in Nuremberg, Germany for a 2 day forum at the Hotel NH Collection. On 4–5 June 2018, presentations and discussions will shape the future of automotive electronics design and manufacturing

IPC reliability forum delivers unique educational and networking opportunities that can’t be found anywhere else in Europe, and serves as an excellent lead-in to the SMT Hybrid Packaging show taking place 5–7 June.

This technical conference covers a wide breadth of relevant and timely topics, and is perfectly suited for engineers and technologists representing Transportation OEMs, Tier 1 systems providers, and assembly, printed circuit board and materials partners. Topics that will be covered on the first day are thermal energy in PCBs, electronic system reliability and performance, and solder masks. An overview of the automotive electronics market will also be presented, along with PCB assembly processes, and impacts of voids in solder joints. Participants will then have the opportunity to network and have conversations after the first day of presentations. On second day, presentations will continue covering topics, including on-board electronics reliability, semiconductor challenges, and miniaturized surface mount technology.


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