Yamaha Motor Europe SMT Section will present its inspection solution, YSi-V AOI system, at the 3D AOI Arena in Munich. The special focus event at productronica 2019, lets visitors see top equipment from the industry’s leading vendors, all in one place, and question experts to discover how state-of-the-art optical inspection can boost precision and productivity.
Multi-vendor participation in the 3D AOI Arena creates a platform for direct comparison to help visitors understand the latest advances and make informed decisions. Opening the event, a panel containing representatives from each company will set the scene with a brief Q&A. Visitors can then get detailed information from manufacturers’ technical teams during subsequent hands-on sessions.
Mr. Ichiro Arimoto, Yamaha Motor Europe IM division, said, “High-performance inspection is increasingly important, not only to handle the growing complexity of today’s assemblies but also to enable real-time line management and capture high-accuracy data for continuous improvement. Our YSi-V system, which visitors can see in close-up detail at this innovative event, makes it real with state-of-the-art lighting and machine-vision technologies for cutting-edge accuracy, resolution, and high speed.”
The YSi-V AOI inline system can be deployed after placement and after reflow to support quality assurance and process control. Leveraging sophisticated communication between the YSi-V and the mounters and screen-print/dispensing machines of the company’s Total Line Solution, the Yamaha Factory Automation 4.0 tools including QA Options can quickly trace the causes of any defects back to the associated feeder, nozzle, or stencil aperture to help restore process control.
With up to 12 Mpixels camera resolution, the YSi-V AOI performs multi-angle and multi-wavelength 2D and 3D optical inspection for today’s most advanced surface-mount assembly challenges. Laser checking of component height and coplanarity is also built-in, enabling fast and accurate inspection of complex mixed-technology assemblies containing any combination of tiny SMDs, fine-pitch ICs and chip-scale packages, and through-hole parts.
The 45-minute event will be presented alternately in German and English on each day of the show, starting from 10.00 am, at the 3D-AOI Arena.
productronica, Booth A3-323, Booth A2-506
