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3D solder joint inspection with eight angled cameras

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3D solder joint inspection with eight angled cameras

At SMTconnect in Nuremberg, Viscom AG presented its S3088 ultra gold system in the field of 3D automatic optical solder joint inspection. The intelligently networkable inline inspection system provides clear, accurate and realistic inspection information, thus enabling optimal quality assurance for electronic assemblies.

The high-precision solder joint measurement using 3D AOI is essential in the inspection of high-end electronics in the automotive sector as well as in other manufacturing sectors for achieving defect-free product quality in the future and long-term customer satisfaction. This 3D AOI system is used successfully for the inspection of components, assemblies and soldered joints and has established itself as a system with outstanding inspection depth and speed.

Its unique performance is enabled by its innovative camera technology: the high-speed Mplus camera module produces easy-to-classify height and position values. The access to exact measuring results helps users to create inspection programs. The quality of the data is crucial for accurate, reliable measurement. That‘s why the S3088 ultra gold measures multiple height profiles at the solder meniscus with a high resolution of 10 μm. Its laterally angled cameras ensure a panoramic view of components and their solder joints from all eight directions. Realistically accurate inspection images, combined with the most reliable verification software, ensure minimal to almost no pseudo-errors.


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