The Phoenix PCBA Sentry is geared towards inspection and failure analysis of the assembly integrity of area-array device package types on boards. The system is fully automated, with an autoloader option, for medium-volume, defect-critical high-performance SMT production lines. With its special, built-in BGA image analysis software, it detects and analyses diameter variations, percentage voids, form errors, misregistrations, pitch error and insufficient solder mass. As a novelty, the instrument determines opens and wetting errors at a known level of confidence. To achieve this, the system applies the advanced OVHM technique (oblique views at highest magnification). Pass/fail levels can be set by the software or operator control.
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