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X-ray inspection of SMT assemblies

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X-ray inspection of SMT assemblies

X-ray inspection of SMT assemblies
Comet’s next-generation Feinfocus Cougar VXP (versatile X-ray platform) is focused on SMT assemblies, addressing the requirements specific to BGA, µBGA, CSP and wafer- level chip-scale (WL-CSP) packages. Powered by a user-friendly graphical user interface, the instrument includes a microfocus X-ray tube of up to 160kV, 5-axes manipulator with auto-isocentric-motion technology for oblique viewing, CNC capabilities, real-time 16-bit image processing, CMOS digital flat-panel detector, and a hardware-driven anti-collision system. The system provides feature recognition down to 1µm, with a total magnification of up to 6000-times and true X-ray intensity control that guarantees stable and permanent image quality, time after time. Users may add features such as BGA and die-attach void-calculation modules, a sophisticated manipulator system, and a multifocus X-ray tube with acceleration voltage of up to 160kV. The ergonomic design makes this inspection platform reportedly ideal for any assembly environment, as it features a small footprint (approximately 1m x 1m), relatively low weight (approximately 1,450kg), and convenient front and side-door service access. A failure analysis configuration is also available, featuring a 6-in image intensifier with digital CCD camera, standard microfocus X-ray tube for up to 160kV and 4-axes manipulator.

Productronica, Booth A2.445
EPP EUROPE 462
Current Issue
Titelbild EPP EUROPE Electronics Production and Test 11
Issue
11.2023
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