Endicott Interconnect Technologies’ organic wire bond plastic ball grid array (PBGA) carriers provide cost effective solutions for silicon applications. They represent precision packaging for today’s semiconductor technology. For extending the use of the existing wirebond infrastructure, these PBGA carriers are available in both chip-up and cavity configurations. The company’s cavity package allows the backside of a die to be thermally connected to a heat spreader. This configuration is mounted to a printed wiring board so that the heat spreader is exposed, allowing for easy attachment of a heat sink for excellent thermal performance. Superior electrical performance, combined with materials that are matched to the printed wiring board, allow the wire bond PBGA carriers to deliver high overall performance and field reliability. The carriers allow access to advanced wire bond substrate and assembly technologies. The carriers support shorter wire lengths and lower loop heights, enabling applications where off-chip speed and lower noise levels are critical. They are especially suited to consumer, data processing and telecommunications products. Industry-standard BT resin and liquid solder mask, provides reliable, cost-effective packaging for die in current and next-generation ASICs and microprocessors. Endicott Interconnect Technologies’ PBGA’s are produced using dense circuitization processes on high volume circuit board equipment.
EPP EUROPE 436
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