High packaging density on board assemblies also poses challenges to cleaning. Residues in even the tightest standoff spaces must be removed. Dr. O.K.Wack Chemie provides an answer with the Vigon US (ultrasonic). This liquid effectively removes RMA, synthetic and water-soluble flux residues as well as solder paste from misprints. The formulation exhibits high contaminant loading capacity, and allows the bath to be used for extended periods. This in turn reduces both bath maintenance and cleaner replacement costs. It was especially developed for ultrasonic-cleaning applications, does not include halogenated compounds, and meets the volatile organic compounds (VOC) requirements for cleaning agents. The cleaner does not contain surfactants, and is biologically degradable. The Vigon RC 101 is a flux remover for manual cleaning that possesses a mild formulation as well as a low alkalinity, and does not require any special labelling. It cleans and dries residue-free. Harmful condensation, which may affect the surface of components, can be avoided. The water-based cleaner has no flash point and can be sprayed onto cold or warm surfaces, and needs a short soak time only. It is available in spray bottles and in refill canisters.
Share:
