BTU’s integrated wafer-bump reflow system can continuously process 200/300mm wafers. Consisting of a TCAS or Paragon furnace, featuring automated loader and unloader stations, the system takes a wafer from a FOUP (front opening unipod), aligns, reads the ID and advances the wafer into the oven onto the belt by a custom-designed dock. The unloader receives the wafer in a similarly designed wafer dock, aligns, reads the ID and returns the reflowed wafer to an empty FOUP. The system complies with I300i standards as well as SEMI S2 and S8 certification. Reflowing bumped wafers in belt furnaces provides several advantages, including high thermal uniformity, repeatability, process flexibility and high-volume.
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