The three high-performance solder pastes of Alpha-Fry are designed to improve line throughput and yield. Broad latitude, no-clean Omnix OM-5002 is a high-speed printing, pintestable paste which tolerates the widest range of processing conditions. Because of its exceptionally wide operating capabilities, this paste is claimed to offer high line throughput, yield and process uptime due to its high-speed print capability, and reduced process adjustment requirement during line changeovers. Omnix OM-6106 is a low-residue, high-speed paste formulated to provide excellent fine-pitch performance. It is a no-clean solution and recommended for 0201-applications, designed for use where a high-speed, high-throughput assembly process requires a particularly efficient material. Also added to the portfolio of lead-free products is Omnix OM-310. Its performance features an SnPb-product and can fit into all conventional processes using specified reflow profiles. It is fast wetting, has a wide print and process window, and is ideal for the majority of assemblers looking to move to lead-free paste.
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