Kester launches a full synthetic no-clean air or nitrogen reflowable solder paste under the formula Liberty 410 that is designed for maximum robustness in reflow profiling and stencil printing. Extreme stability is positive for the extremely long processing time of up to 8 hours without any shear shining. The paste can also be used for vapor phase and soft-beam laser soldering as well as for full convection. The wetting performance has been stable over all solder profiles. It is available in different alloys like Sn63Pb37 and Sn62Pb36Ag02 as well as in the lead-free alloys Sn95,5Ag3,8Cu0,7 or Sn99,3Cu0,7. Kester recommends type 3 powder mesh, but different powder particle size distributions are available for standard and fine-pitch applications. The typical squeegee speed is 25mm/s which can be go up to 200mm/s. The residues do not need to be removed for typical applications. Liberty 410 fulfils all the requirements of EN 61191-1, cleanliness 9.5.4. Although it is designed for no-clean applications, residues can be easily removed using normal cleaning equipment.
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