Amkor continues to add solutions to its 3D package portfolio with a recent qualification of its stacked-CSP (chip-scale package) on a tape platform. The qualification met the requirements, passing EIA/Jedec Level 2 (at 260°C) moisture resistance testing (MRT). This package brings to market a tape-based, stacked-CSP solution that is reportedly thin, light weight, low cost, highly reliable and environmentally safe .
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