The Harotec Ecosold 350 soldering system is especially useful for assemblies populated with PCBs, BGAs, SMD sockets, PLCCs and QFPs. lt features filament heaters mounted on the outer panels of the process chamber, which are surrounded by ambient air. This design prevents the cooling down of the assembly borders. There is no shadowing underneath of BGAs or SMD sockets. Inside the process chamber, the air circulates several times during drying, activation and peak soldering. To maintain an optimal thermoprofile at the underside of the board, the chamber has dark emitters activated during the entire process. IR emitters on the upper side counter temperature drops during peak soldering. Being applied at the end of the soldering process, this avoids temperature stress on components. The usable size format of the carrier is 350 x 500mm. The standard machine offers nine programs for drying and curing adhesives; an optional EPROM contains 50 more programs.
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