PDR’s X410 BGA/SMT rework station is a tool-free, gas-free system based on focused IR technology. It delivers high levels of profiling for handling of the most advanced packages, such as SMDs, BGAs, CSPs and flip chips, as well as 0201s and lead-free applications. The 150W heating is using lens-based infrared radiation, which reportedly is ideal for reworking on hidden-joint devices, because the heat is safely supplied with no effect on any adjacent packages. Mechanics, optics and control allow an operator to quickly and easily pick up a BGA from the nest, align it and place it onto fluxed pads. It can then be reflowed via closed-loop component and board-temperature controls. Boards up to 420 x 500mm (17 x 20-in) are held securely on a macro-micro XY table. The table features adjustments providing ±10microns movement in X and Y directions and has a macro override facility. The standard F700 attachment creates heating spot sizes from 25 to 70mm (0.98 x 2.7-in) in diameter, and there are three optional attachments for spots down to 4mm. Underside heating is provided by 600W medium-wave infrared sources that make up two zones: an inner 120 x 300mm (4.72 x 11.81-in) and a combined 240 x 300mm (9.45 x 11.81-in). A vacuum-operated component placement unit delivers precise Z-axis movement. It has micrometer control for soft landing, and allows the device to be rotated through a full 360°. A component nest and print-frame facility is also included for applying solder paste. A K-type, non-contact IR sensor measures the component temperature throughout the process, while boards are measured by an attached K-type sensor. The process runs under software control, including real-time component and board temperature control, profile setting, temperature profiling and data logging. An optional system features split-beam simultaneous alignment of the board and component, and a camera delivers images to a 15-in LCD monitor.
EPP EUROPE 418
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