The NPL has launched a report on thermal profiling. It will assist all those companies that are soldering board, and they will find the code of practice useful. With the advent of lead-free soldering, there is a greater need for thermal profiling, so that the more stringent requirements of achieving reflow while not exceeding the specified maximum temperature can be met. The need for greater precision has required that all aspects of profiling have been investigated and the impact on the measurement certainly assessed.
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