Rapid Oven Setup (ROS) from Datapaq can automate the process of optimizing reflow oven settings, for soldering diverse board assemblies or for profiling. The system uses a custom-designed sensor to measure the capability of the oven. This data is combined with information on the board and target profile to create a mathematical model of the process. The resulting output is an optimal recipe producing profiles that are right the first time. Data from the heat-transfer sensor is used to characterize an oven. The software uses data from black, gold and air temperature sensors to create a model of the oven performance. The ROS software breaks the product down into hundreds of elements. A finite difference method is used to calculate a profile for each element. These virtual thermocouples enable the user to verify the profile at any point on the product.
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