DEK has introduced the Low Volume ProFlow transfer head, reducing costs and enhancing the precision of high-accuracy paste print using very small quantities of high-value material. These include fine-particle, low-alpha solder pastes and high gold-content compounds used to create grid arrays and other features in advanced packages such as CSP and flip chip. This addition is designed to achieve high accuracy and repeatability in processes requiring individual deposits less than 200mg. The head achieves greater metering accuracy by reducing material pressure variation, and features a locking mechanical interface that ensures the assembly is held perfectly perpendicular to the stencil surface. This results in enhanced volume consistency of the deposited material. A range of low-volume heads is now available. They can be filled from a syringe, rather than by replacing a cassette, and are compatible with any printer equipped to accept a ProFlow head and featuring the software Controlled Air Regulator.
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