Precisely at the point Torsten Vegelahn, Asys Group/Ekra, Dornstadt, Germany

High flexibility and zero defect production are targets in electronics production. But over and over there are components that cause trouble. In general these are components such as connector strips/edge connectors, power components, pin in paste, components soldered only from one side, or so-called special cases such as shield plates. These components can be manufactured by the standard stencil printing process only in a limited way. Either the components need more solder paste, in order to enable a flawless soldering or it takes additional glue dots to fix the components. The iPAG dispense system is mounted at the printer’s camera portal. Thus enables to approach any user defined position in the printer and to deposit glue or solder paste dots on he product. This step follows right after the screen- or stencil printing. As a rule, a heightened demand for solder paste can be covered with step stencils. But there are exceptions to the rule. And Ekra has developed the iPAG for exactly the very same requirements. By means of the dispense system it is possible to set additional solder paste dots directly after the stencil printing or to increase the existing solder depots. On top of the board, shield plates are being assembled. The then required solder paste can be dispensed by the iPAG.

The dispense system is ideal when components are twisted in the reflow process as a result of their size and their weight. Within a flash, the needed glue dots are programmed, and thus the process is secured. For every dispense dot explicit, dataset can be configured. This way the iPAG dispense system can constitute different volumes. Since November 2007 Hekatron Technik located in Sulzburg, Germany, has been a successful user of the dispense system integrated in the printer X6. The company is a leading specialist for developing, manufacturing as well as sales and distribution of electronic security systems. The products have to fulfil highest standards in respect to quality and reliability, since they protect human life and material assets. Based on this, quality demands benefit both customers of the security branch and those who have their products manufactured externally at Hekatron as an EMS provider. “More than 30 products are being manufactured securely as well as reasonably by means of the iPAG,” said Reinhard Stark, production engineer (TPF Technology, Production, Flat module/PCB). “Due to the mechanical demands of our products some components have to be adhered,” said Stark. “The soldering of the components from only one side would rapidly lead to outfalls.” Figure 4 shows glue dots before the assembly with a resonator. Without these glue dots this component, as a result of vibrations, would loosen from the board and cause a malfunction of the signal unit. Figure 5 shows the glued and soldered component. After the glue was printed the glue volume, here shown under a SOIC (figure 6 and 7), will be completed via the dispense system. The iPAG glue and paste dispense system integrated in a printer saves production area and it is always optimal for use when it is needed. At this year’s APEX in Las Vegas (USA) it was rewarded with the prestigious IPC Award. Torsten Vegelahn, SMT product manager at Ekra, comments on this: “This award shows us, that with these developments we meet the needs of the users. As a provider of printing machines we see our strength above all as a technology partner and in the development of innovative solutions for our customers.” (jau)

EPP Europe 445

Vorgestellt wird ein Dispense-System, das direkt am Kameraportal des Druckers angebracht ist. Somit ist es möglich, jede beliebige Position im Drucker anzufahren und Klebe- oder Lotpastenpunkte auf das Produkt aufzubringen. Dieser Schritt erfolgt direkt nach dem Sieb- oder Schablonendruck.

L’article présente un système de distribution directement monté sur le support caméra de l’imprimante. Ce système permet ainsi de placer chaque position désirée sur l’imprimante et d’appliquer des points de colle ou de pâte à braser sur le produit. Cette étape suit directement la sérigraphie.

Viene presentato un sistema di dosaggio applicato direttamente al portale della camera della stampante. Pertanto è possibile portarsi su qualsiasi posizione nella stampante e mettere sul prodotto punti di colla o di pasta per saldare. Questo passaggio avviene direttamente dopo la stampa serigrafica o a stencil.