CyberOptics has introduced the KS 75 AOI system for solder joint inspection and component defect detection. The instrument uses high-resolution color imaging and statistical appearance modeling (SAM) to identify SMT and through-hole defects whereby delivering low false calls. KS 75 identifies bridges on leaded devices including ultra-fine pitch QFP, locates missing, insufficient or excess solder, and verifies presence, identity, polarity and location of components as small as 0201s. The knowledge-based SAM software learns how to recognize good solder joints, thus eliminating the need for finely tuned algorithms. Because SAM is inherently capable of analyzing and recognizing variations in good solder joints without sacrificing the ability to identify defects, false calls are great-ly minimized, decreasing over time to reportedly very low levels. The machine features a conveyor automatic width adjustment, and process advisory software tools for analysis and SPC. Rework station and off-line programming station are optional.
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