Two formulations from Polymer Flip Chip Corp. realize an optimally high glass transition temperature value (Tg) of >250°C. EPO-TEK 353ND-10 was developed for fiber-optical applications. Beside the high Tg value, the material has a high degradation temperature of 450°C. Operating temper-ature is 200°C continuous, and 400°C intermittent. Cure schedule is 200°C/hr. In addition, the material shows a low modulus and long shelf life at room temperature. Also presently evaluated for stencil-printing on a wafer for producing sensor components is the formulation T3084-A2. This is a solvent-free, thermally conductive polymer for wafer passivation in high-temperature applications. The images print very sharply without pinholes and bleed-out. Once on the screen, the formulation won’t dry out over a period of several days.