Kurtz Ersa North America announced the Smartflow 2020 selective soldering system and Hotflow 3/20 third generation reflow oven. The Smartflow 2020 selective soldering system requires less than 3 m² of space, thus fitting optimally into cell production environments. In all process steps the automatic system uses the same successful and proven selective soldering technology as the large Versaflow systems without compromising quality and accuracy. With Smartflow, the company finally closes the gap from its high end Versaflow platform to an entry level machine. Due to its universal pallet fastening, it can handle PCB sizes of up to 508 x 508 mm [20” x 20”].
The Hotflow 3/20 is based on the proven and proprietary Multijet heating technology. The R&D of this series was focused on improved heat transfer via a complete re-design of the process tunnel, reduced energy and N2 consumption, improved cooling, as well as optimized process control. From a productivity versus floor space requirement standpoint, it sets the industry standard. With dual, triple and now quad track options, it is possible to increase throughput by as much as 400 percent without increasing floor space. Tracks run at their own set speed and at their own PCB width for maximum flexibility.
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