Placing of components or dispensing of liquids are the application areas of the multifunctional positioning and soldering system Onyx 32. With options, the Zevac machine can be configured to address the following: hot gas soldering, pick up and automatic placement of SMDs, BGAs and CSPs with force control, selective soldering and desoldering, flux and removal of site solder, pick and place or rework with force control using a conductive heating, soldering and desoldering with conductive heating head, and dispensing of adhesive, flux, solder paste or underfill. The machine with its 4-axes positioning system is controlled by software. Once the board has been loaded manually, the system can handle the programmed process independently and fully automatic. All parameter (force, temperature, gas volume, pressure) as well as the position data and camera signals are specifically transferred via Firewire interface bus (400MB data rate). Boards with dimensions from 20 x 20mm up to 355 x 680mm can be processed.
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