The 8-in die bonder and component placer T-3X02 of Dr. Tresky enables epoxy and optional eutectic bonding of dies picked-up from wafer, waffle packs or surf tapes, loading of waffle packs, dispensing or stamping of adhesives as well as placement of SMDs. It is especially suitable for a broad range of MCM hybrid, COB and optoelectronics applications. If features a placement area of 215 x 215mm with a 1µm measuring system and positioning accuracy of ± 5µm, wafer pick-up of up to 8-in and a vertical movement of 100mm. The T-3102 enables a disconnectable XYZ drive system for manual, semiautomatic or automatic mode of operation, and a PC supported teach-in procedure providing an easy and quick programming of bonding parameters. As in all Tresky die bonders, the T-3X02 uses a patented die ejector system in which the separation of the die from the foil ensues through the pull down of the foil, whereas the die remains stationary. Therefore the usual dynamic forces appearing through the acceleration of the chip, as well as all pick-up tool assembly parts, do not arise.
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